검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Electrochemical investigation of Pd-free electroless Co-based capping layers on Cu surfaces Chang SY, Wan CC, Wang YY, Shih CH, Shue SL Journal of the Electrochemical Society, 155(1), D62, 2008 |
| 2 |
Characterization of Pd-free electroless Co-based cap selectively deposited on Cu surface via borane-based reducing agent Chang SY, Wan CC, Wang YY, Shih CH, Tsai MH, Shue SL, Yu CH, Liang MS Thin Solid Films, 515(3), 1107, 2006 |
| 3 |
Diffusion of copper in titanium zirconium nitride thin films Kuo YL, Lee HH, Lee C, Lin JC, Shue SL, Liang MS, Daniels BJ Electrochemical and Solid State Letters, 7(3), C35, 2004 |
| 4 |
Growth of (Ti, Zr)N films on Si by DC reactive sputtering of TiZr in N2/Ar gas mixtures - Effect of flow ratio Kuo YL, Lee C, Lin JC, Peng CH, Chen LC, Hsieh CH, Shue SL, Liang MS, Daniels BJ, Huang CL, Lai CH Journal of the Electrochemical Society, 151(3), C176, 2004 |
| 5 |
Superpolishing for planarizing copper damascene interconnects Chang SC, Shieh JM, Dai BT, Feng MS, Li YH, Shih CH, Tsai MH, Shue SL, Liang RS, Wang YL Electrochemical and Solid State Letters, 6(5), G72, 2003 |
| 6 |
Characteristics of DC reactively sputtered (Ti,Zr)N thin films as diffusion barriers for Cu metallization Kuo YL, Lee C, Lin JC, Peng CH, Chen LC, Hsieh CH, Shue SL, Liang MS, Daniels BJ, Huang CL, Lai CH Electrochemical and Solid State Letters, 6(9), C123, 2003 |