검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
SiC power device packaging technologies for 300 to 350 degrees C applications Johnson RW, Williams J Materials Science Forum, 483, 785, 2005 |
| No. | Article |
|---|---|
| 1 |
SiC power device packaging technologies for 300 to 350 degrees C applications Johnson RW, Williams J Materials Science Forum, 483, 785, 2005 |