| 1 |
Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers
Siau S, Vervaet A, Degrendele L, De Baets J, Van Calster A
Applied Surface Science, 252(8), 2717, 2006 |
| 2 |
Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics
Vervaet A, Siau S, De Baets J, Manirambona B
Applied Surface Science, 252(23), 8243, 2006 |
| 3 |
Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics
Siau S, Vervaet A, Schacht E, Demeter U, Van Calster A
Thin Solid Films, 495(1-2), 348, 2006 |
| 4 |
Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes
Siau S, Vervaet A, Degrande S, Schacht E, Van Calster A
Applied Surface Science, 245(1-4), 353, 2005 |
| 5 |
Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
Siau S, Vervaet A, Van Vaeck L, Schacht E, Demeter U, Van Calster A
Journal of the Electrochemical Society, 152(6), C442, 2005 |
| 6 |
Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
Siau S, Vervaet A, Schacht E, Degrande S, Callewaert K, Van Calster A
Journal of the Electrochemical Society, 152(9), D136, 2005 |
| 7 |
Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer
Siau S, Vervaet A, Van Calster A, Swennen I, Schacht E
Applied Surface Science, 237(1-4), 456, 2004 |
| 8 |
Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections
Siau S, Vervaet A, Schacht E, Van Calster A
Journal of the Electrochemical Society, 151(2), C133, 2004 |
| 9 |
Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments
Siau S, Vervaet A, Van Calster A, Swennen I, Schacht E
Journal of the Electrochemical Society, 151(8), J54, 2004 |
| 10 |
Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - I. Sweller influence
Siau S, Vervaet A, Nalines S, Schacht E, Van Calster A
Journal of the Electrochemical Society, 151(12), C816, 2004 |
