검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching Filippi RG, Gribelyuk MA, Joseph T, Kane T, Sullivan TD, Clevenger LA, Costrini G, Gambino J, Iggulden RC, Kiewra EW, Ning XJ, Ravikumar R, Schnabel RF, Stojakovic G, Weber SJ, Gignac LM, Hu CK, Rath DL, Rodbell KP Thin Solid Films, 388(1-2), 303, 2001 |
| 2 |
Reactive ion etch of 150 nm Al lines for interconnections in dynamic random access memory Stojakovic G, Ning XJ Journal of Vacuum Science & Technology A, 18(4), 1425, 2000 |