검색결과 : 13건
| No. | Article |
|---|---|
| 1 |
Wet-chemical etching of metals for advanced semiconductor technology nodes: Ru etching in acidic Ce4+ solutions Philipsen H, Mouwen N, Teck S, Monnens W, Le QT, Holsteyns F, Struyf H Electrochimica Acta, 306, 285, 2019 |
| 2 |
Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces Philipsen H, Jehoul H, Inoue F, Vandersmissen K, Yang L, Struyf H, van Dorp D Electrochimica Acta, 230, 407, 2017 |
| 3 |
Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent Inoue F, Philipsen H, van der Veen MH, Van Huylenbroeck S, Armini S, Struyf H, Tanaka T Journal of the Electrochemical Society, 161(14), D768, 2014 |
| 4 |
Impact of Plasma Pretreatment and Pore Size on the Sealing of Ultra-Low-k Dielectrics by Self-Assembled Monolayers Sun YT, Krishtab M, Struyf H, Verdonck P, De Feyter S, Baklanov MR, Armini S Langmuir, 30(13), 3832, 2014 |
| 5 |
Effect of UV Irradiation on Modification and Subsequent Wet Removal of Model and Post-Etch Fluorocarbon Residues Le QT, de Marneffe JF, Conard T, Vaesen I, Struyf H, Vereecke G Journal of the Electrochemical Society, 159(3), H208, 2012 |
| 6 |
Towards Fully Aqueous Ozone Wet Strip of 193 nm Photoresist Stack Using UV Pre-Treatments in Low-k Patterning Applications Kesters E, Le QT, Lux M, Pittevils J, Vereecke G, Struyf H, De Gendt S Journal of the Electrochemical Society, 159(5), D287, 2012 |
| 7 |
Characterization of Modification of 193-nm Photoresist by HBr Plasma Vereecke G, Claes M, Le QT, Kesters E, Struyf H, Carleer R, Adriaensens P Electrochemical and Solid State Letters, 14(10), H408, 2011 |
| 8 |
Atomic Layer Deposition of High-kappa Dielectrics on Sulphur-Passivated Germanium Sioncke S, Lin HC, Brammertz G, Delabie A, Conard T, Franquet A, Meuris M, Struyf H, De Gendt S, Heyns M, Fleischmann C, Temst K, Vantomme A, Muller M, Kolbe M, Beckhoff B, Caymax M Journal of the Electrochemical Society, 158(7), H687, 2011 |
| 9 |
Effect of energetic ions on plasma damage of porous SiCOH low-k materials Kunnen E, Baklanov MR, Franquet A, Shamiryan D, Rakhimova TV, Urbanowicz AM, Struyf H, Boullart W Journal of Vacuum Science & Technology B, 28(3), 450, 2010 |
| 10 |
High aspect ratio via etch development for Cu nails in 3-D-stacked ICs Van Aelst J, Struyf H, Boullart W, Vanhaelemeersch S Thin Solid Films, 516(11), 3502, 2008 |