1 |
A new loop-shaping procedure for the tuning LQ-PID regulator Yang JH, Suh BS Journal of Chemical Engineering of Japan, 40(7), 575, 2007 |
2 |
A tuning of PID regulators via LQR approach Suh BS, Yang JH Journal of Chemical Engineering of Japan, 38(5), 344, 2005 |
3 |
Properties of reactively sputtered WNx as Cu diffusion barrier Suh BS, Lee YJ, Hwang JS, Park CO Thin Solid Films, 348(1-2), 299, 1999 |
4 |
Co-sputter deposited Ta-Si diffusion barrier between Si and Cu: the effects of Si content on the barrier property Lee YJ, Suh BS, Park CO Thin Solid Films, 357(2), 237, 1999 |
5 |
Structural and chemical stability of Ta-Si-N thin film between Si and Cu Lee YJ, Suh BS, Rha SK, Park CO Thin Solid Films, 320(1), 141, 1998 |
6 |
테르펜 수지에 의한 폴리아미드계 핫멜트 접착제의 인장거동 및 유변학적거동의 조절 정경호, 서봉성, 홍영근, 전영식 Applied Chemistry, 1(2), 668, 1997 |
7 |
Surface Hardening of AISI 316L Stainless-Steel Using Plasma Carburizing Suh BS, Lee WJ Thin Solid Films, 295(1-2), 185, 1997 |
8 |
생의용 고분자의 합성과 물성에 관한 연구 : Poly(2-hydroxyethyl methacrylate-co-γ-methacryloxypropyl triethyl silane) 및 Poly(2-hydroxyethyl methacrylate-co-γ-methacryloxypropylmethyl bistrimethyl siloxysilane)의 합성과 물성 성용길, 정태화, 이상영, 정일남, 배선호, 서배석 Polymer(Korea), 10(4), 362, 1986 |