검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Fabrication and characterization of micro-sized copper bump of multi-layer PCB by pulse-reverse electroplating Hong HS, Seo MH, Lee S, Hong SJ, Suk HG, Ahn JH Current Applied Physics, 11(1), S289, 2011 |
| No. | Article |
|---|---|
| 1 |
Fabrication and characterization of micro-sized copper bump of multi-layer PCB by pulse-reverse electroplating Hong HS, Seo MH, Lee S, Hong SJ, Suk HG, Ahn JH Current Applied Physics, 11(1), S289, 2011 |