검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers Chen ST, Chung YC, Fang JS, Cheng YL, Chen GS Applied Surface Science, 405, 350, 2017 |
| 2 |
Seedless copper electroplating on Ta from an alkaline activated bath Starosvetsky D, Sezin N, Ein-Eli Y Electrochimica Acta, 82, 367, 2012 |
| 3 |
Seedless copper electroplating on Ta from a "single" electrolytic bath Starosvetsky D, Sezin N, Ein-Eli Y Electrochimica Acta, 55(5), 1656, 2010 |