검색결과 : 20건
| No. | Article |
|---|---|
| 1 |
Intermixing behaviors of PCBM with CuPc on Au(111) surface Masui A, Sakaue H, Takahagi T, Suzuki H Chemical Physics Letters, 661, 215, 2016 |
| 2 |
New method to calibrate binding energy using Au nanocolloids in X-ray photoelectron analysis of diamondlike carbon films with different electrical resistivities Takabayashi S, Okamoto K, Motomitsu K, Terayama A, Nakatani T, Sakaue H, Suzuki H, Takahagi T Applied Surface Science, 254(9), 2666, 2008 |
| 3 |
Epitaxial growth of Cu nanodot arrays using an AAO template on a Si substrate Shimizu T, Nagayanagi M, Ishida T, Sakata O, Oku T, Sakaue H, Takahagi T, Shingubara S Electrochemical and Solid State Letters, 9(4), J13, 2006 |
| 4 |
Bottom-up copper fill with addition of mercapto alkyl carboxylic acid in electroless plating Wang ZL, Obata R, Sakaue H, Takahagi T, Shingubara S Electrochimica Acta, 51(12), 2442, 2006 |
| 5 |
Characterization of electroless-plated Cu film over Pd catalytic layer formed by an ionized cluster beam Wang ZL, Shingubara S, Sakaue H, Takahagi T Journal of the Electrochemical Society, 152(10), C684, 2005 |
| 6 |
Wet treatment for preparing atomically smooth Si(100) wafer surface Sakaue H, Taniguchi Y, Okamura Y, Shingubara S, Takahagi T Applied Surface Science, 234(1-4), 439, 2004 |
| 7 |
Self-organization of a porous alumina nanohole array using a sulfuric/oxalic acid mixture as electrolyte Shingubara S, Morimoto K, Sakaue H, Takahagi T Electrochemical and Solid State Letters, 7(3), E15, 2004 |
| 8 |
Bottom-up fill of copper in deep submicrometer holes by electroless plating Shingubara S, Wang ZL, Yaegashi O, Obata R, Sakaue H, Takahagi T Electrochemical and Solid State Letters, 7(6), C78, 2004 |
| 9 |
Focal-point anchoring: Large proton relaxivity observed for gadolinium-cored dendrimer complexes in water Kawa M, Takahagi T Journal of Polymer Science Part B: Polymer Physics, 42(14), 2680, 2004 |
| 10 |
Bottom-up fill for submicrometer copper via holes of ULSIs by electroless plating Wang ZL, Yaegashi O, Sakaue H, Takahagi T, Shingubara S Journal of the Electrochemical Society, 151(12), C781, 2004 |