검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry Du TB, Tamboli D, Luo Y, Desai V Applied Surface Science, 229(1-4), 167, 2004 |
| 2 |
Novel interpretations of CMP removal rate dependencies on slurry particle size and concentration Tamboli D, Banerjee G, Waddell M Electrochemical and Solid State Letters, 7(10), F62, 2004 |
| 3 |
Mechanism of copper removal during CMP in acidic H2O2 slurry Du T, Tamboli D, Desai V, Seal S Journal of the Electrochemical Society, 151(4), G230, 2004 |
| 4 |
Studies on passivation behavior of tungsten in application to chemical mechanical polishing Tamboli D, Seal S, Desai V, Maury A Journal of Vacuum Science & Technology A, 17(4), 1168, 1999 |