검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices Scandurra A, Zafarana R, Tenya Y, Pignataro S Applied Surface Science, 235(1-2), 65, 2004 |
| 2 |
Study of adhesion failure due to molding compound additives at chip surface in electronic devices Scandurra A, Zafarana R, Tenya Y, Pignataro S Journal of Adhesion Science and Technology, 15(9), 1039, 2001 |