검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Effect of Ni-P thickness on solid-state interfacial reactions between Sn-3.5Ag solder and electroless Ni-P metallization on Cu substrate Kumar A, Chen Z, Mhaisalkar SG, Wong CC, Teo PS, Kripesh V Thin Solid Films, 504(1-2), 410, 2006 |
| 2 |
The effect of annealing on the morphologies and conductivities of sub-micrometer sized nickel particles used for electrically conductive adhesive Goh CF, Yu H, Yong SS, Mhaisalkar SG, Boey FY, Teo PS Thin Solid Films, 504(1-2), 416, 2006 |
| 3 |
Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5% Ag solder Kumar A, He M, Chen Z, Teo PS Thin Solid Films, 462-63, 413, 2004 |
| 4 |
Development and reliability of non-conductive adhesive flip-chip packages Teh LK, Anto E, Wong CC, Mhaisalkar SG, Wong EH, Teo PS, Chen Z Thin Solid Films, 462-63, 446, 2004 |