검색결과 : 8건
| No. | Article |
|---|---|
| 1 |
A feature scale model for chemical mechanical planarization of damascene structures Saxena R, Thakurta DG, Gutmann RJ, Gill WN Thin Solid Films, 449(1-2), 192, 2004 |
| 2 |
Surface kinetics model for SiLK chemical mechanical polishing Borst CL, Thakurta DG, Gill WN, Gutmann RJ Journal of the Electrochemical Society, 149(2), G118, 2002 |
| 3 |
Three-dimensional wafer-scale copper chemical-mechanical planarization model Thakurta DG, Schwendeman DW, Gutmann RJ, Shankar S, Jiang L, Gill WN Thin Solid Films, 414(1), 78, 2002 |
| 4 |
Three-dimensional chemical mechanical planarization slurry flow model based on lubrication theory Thakurta DG, Borst CL, Schwendeman DW, Gutmann RJ, Gill WN Journal of the Electrochemical Society, 148(4), G207, 2001 |
| 5 |
Pad porosity, compressibility and slurry delivery effects in chemical-mechanical planarization: modeling and experiments Thakurta DG, Borst CL, Schwendeman DW, Gutmann RJ, Gill WN Thin Solid Films, 366(1-2), 181, 2000 |
| 6 |
Two-dimensional wafer-scale chemical mechanical planarization models based on lubrication theory and mass transport Sundararajan S, Thakurta DG, Schwendeman DW, Murarka SP, Gill WN Journal of the Electrochemical Society, 146(2), 761, 1999 |
| 7 |
Chemical mechanical polishing mechanisms of low dielectric constant polymers in copper slurries Borst CL, Thakurta DG, Gill WN, Gutmann RJ Journal of the Electrochemical Society, 146(11), 4309, 1999 |
| 8 |
Thermophoretic deposition of small particles in a direct numerical simulation of turbulent channel flow Thakurta DG, Chen M, McLaughlin JB, Kontomaris K International Journal of Heat and Mass Transfer, 41(24), 4167, 1998 |