검색결과 : 11건
| No. | Article |
|---|---|
| 1 |
Ultra-Low Copper Baths for Sub-35 nm Copper Interconnects Atanasova TA, Carbonell L, Caluwaerts R, Tokei Z, Strubbe K, Vereecken PM Journal of the Electrochemical Society, 160(12), D3255, 2013 |
| 2 |
Study of Chemical Vapor Deposition of Manganese on Porous SiCOH Low-k Dielectrics Using Bis(ethylcyclopentadienyl)manganese Jourdan N, Krishtab MB, Baklanov MR, Meersschaut J, Wilson CJ, Ablett JM, Fonda E, Zhao L, Van Elshocht S, Tokei Z, Vancoille E Electrochemical and Solid State Letters, 15(5), H176, 2012 |
| 3 |
Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers Zhao L, Lofrano M, Croes K, Van Besien E, Tokei Z, Wilson CJ, Degraeve R, Kauerauf T, Beyer GP, Claeys C Thin Solid Films, 520(1), 662, 2011 |
| 4 |
Analysis and characterization of a mechanical sensor to monitor stress in interconnect features Wilson CJ, Croes K, Tokei Z, Beyer GP, Gallacher BJ, Bull SJ, Horsfall AB, O'Neill AG Thin Solid Films, 519(1), 443, 2010 |
| 5 |
The Importance of Moisture Control for EOT Scaling of Hf-Based Dielectrics Ragnarsson LA, Brunco DP, Yamamoto K, Tokei Z, Pourtois G, Delabie A, Parmentier B, Conard T, Roussel P, De Gendt S, Heyns MM Journal of the Electrochemical Society, 156(6), H416, 2009 |
| 6 |
Influence of TaN gate electrode microstructure on its dry etch properties Shamiryan D, Paraschiv V, Tokei Z, Beckx S, Boullart W Electrochemical and Solid State Letters, 9(8), G272, 2006 |
| 7 |
Fabrication of 100 nm pitch copper interconnects by electron beam lithography Wu W, Jonckheere R, Tokei Z, Brongersma SH, Van Hove M, Maez K Journal of Vacuum Science & Technology B, 22(4), L11, 2004 |
| 8 |
Characterization of Cu surface cleaning by hydrogen plasma Baklanov MR, Shamiryan DG, Tokei Z, Beyer GP, Conard T, Vanhaelemeersch S, Maex K Journal of Vacuum Science & Technology B, 19(4), 1201, 2001 |
| 9 |
Surface treatment and cold working as tools to improve oxidation behaviour of chromium steels Piehl C, Tokei Z, Grabke HJ Materials Science Forum, 369-3, 319, 2001 |
| 10 |
First stages in the formation of ultra thin nickel layers on Cu(111) and Ge(111) and dissolution: an AES comparative study Girardeaux C, Tokei Z, Clugnet G, Rolland A Applied Surface Science, 162, 208, 2000 |