검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Prevention of Cu degradation using in situ N-2 plasma treatment in a dual-damascene process Tomohisa S, Yoshikawa K, Yonekura K, Sakamori S, Fujiwara N, Tsujimoto K, Nishioka K, Kobayashi H, Oomori T Journal of Vacuum Science & Technology B, 23(5), 2084, 2005 |
| 2 |
Transport mechanisms of ions and neutrals in low-pressure, high-density plasma etching of high aspect ratio contact holes Nishikawa K, Ootera H, Tomohisa S, Oomori T Thin Solid Films, 374(2), 190, 2000 |