검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Bonding temperature effects on the wide gap transient liquid phase bonding of Inconel 718 using BNi-2 paste filler metal Yan GX, Bhowmik A, Nagarajan B, Song X, Tan SC, Tan MJ Applied Surface Science, 484, 1223, 2019 |
| 2 |
Sequential interfacial reactions of Au/In/Au transient liquid phase-bonded joints for power electronics applications Yoon JW, Lee BS Thin Solid Films, 660, 618, 2018 |
| 3 |
The shear strength of transient liquid phase bonded Sn-Bi solder joint with added Cu particles Mokhtari O, Nishikawa H Advanced Powder Technology, 27(3), 1000, 2016 |
| 4 |
Design and testing of a microchannel reactor for the PROX reaction Cruz S, Sanz O, Poyato R, Laguna OH, Echave FJ, Almeida LC, Centeno MA, Arzamendi G, Gandia LM, Souza-Aguiar EF, Montes M, Odriozola JA Chemical Engineering Journal, 167(2-3), 634, 2011 |
| 5 |
Transient liquid phase bonding of intermetallic compounds Gale WF Materials Science Forum, 426-4, 1891, 2003 |