검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Bottom-Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2-Derived Self-Assembled Monolayers Caro AM, Armini S, Richard O, Maes G, Borghs G, Whelan CM, Travaly Y Advanced Functional Materials, 20(7), 1125, 2010 |
| 2 |
Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment Urbanowicz AM, Baklanov MR, Heijlen J, Travaly Y, Cockburn A Electrochemical and Solid State Letters, 10(10), G76, 2007 |
| 3 |
Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment (vol 10, pg G76, 2007) Urbanowicz AM, Baklanov MR, Heijlen J, Travaly Y, Cockburn A Electrochemical and Solid State Letters, 10(11), S7, 2007 |
| 4 |
Minimizing plasma damage and in situ sealing of ultralow-k dielectric films by using oxygen free fluorocarbon plasmas Mannaert G, Baklanov MR, Le QT, Travaly Y, Boullart W, Vanhaelemeersch S, Jonas AM Journal of Vacuum Science & Technology B, 23(5), 2198, 2005 |
| 5 |
Theoretical modeling of the nucleation and growth of aluminium films thermally evaporated onto poly(ethylene terephthalate) substrate Travaly Y, Bertrand P, Rignanese GM, Gonze X Journal of Adhesion, 66(1), 339, 1998 |