검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of in situ plasma oxidation of TiN diffusion barrier for AlSiCu/TiN/Ti metallization structure of integrated circuits Fortin V, Gujrathi SC, Gagnon G, Gauvin R, Currie JF, Ouellet L, Tremblay Y Journal of Vacuum Science & Technology B, 17(2), 423, 1999 |
| 2 |
The Effect of the Ti Glue Layer in an Integrated Ti/Tin/Ti/Alsicu/Tin Contact Metallization Process Ouellet L, Tremblay Y, Gagnon G, Caron M, Currie JF, Gujrathi SC, Biberger M Journal of Vacuum Science & Technology B, 14(4), 2627, 1996 |
| 3 |
Effect of the Ti/Tin Bilayer Barrier and Its Surface-Treatment on the Reliability of a Ti/Tin/Alsicu/Tin Contact Metallization Ouellet L, Tremblay Y, Gagnon G, Caron M, Currie JF, Gujrathi SC, Biberger M Journal of Vacuum Science & Technology B, 14(6), 3502, 1996 |