검색결과 : 2건
No. | Article |
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1 |
Adhesion studies of Ta/low-k (Black Diamond) interface using thermocompressive wafer bonding and four-point bend Teh WH, Tsang CF, Trigg A, Teoh KW, Kumar R, Balasubramanian N, Kwong DL, Ong SE, Malik F, Gan CL Journal of the Electrochemical Society, 153(9), G795, 2006 |
2 |
Localized germanium-on-insulator patterns on Si by novel etching scheme in CF4/O-2 plasma Murthy BR, Balasubramanian N, Balakumar S, Mukherjee-Roy M, Trigg A, Kumar R, Kwong DL Thin Solid Films, 504(1-2), 77, 2006 |