검색결과 : 16건
| No. | Article |
|---|---|
| 1 |
Grain boundary character distribution in electroplated nanotwinned copper Ratanaphan S, Raabe D, Sarochawikasit R, Olmsted DL, Rohrer GS, Tu KN Journal of Materials Science, 52(7), 4070, 2017 |
| 2 |
Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints Ouyang FY, Tu KN, Lai YS Materials Chemistry and Physics, 136(1), 210, 2012 |
| 3 |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper Hsiao HY, Liu CM, Lin HW, Liu TC, Lu CL, Huang YS, Chen C, Tu KN Science, 336(6084), 1007, 2012 |
| 4 |
Crystallization of amorphous SiO2 microtubes catalyzed by lithium Zhao LL, Li N, Langner A, Steinhart M, Tan TY, Pippel E, Hofmeister H, Tu KN, Gosele U Advanced Functional Materials, 17(12), 1952, 2007 |
| 5 |
Theoretical studies of displacement deposition of nickel into porous silicon with ultrahigh aspect ratio Xu CK, Li MH, Zhang X, Tu KN, Xie YH Electrochimica Acta, 52(12), 3901, 2007 |
| 6 |
Nickel displacement deposition of porous silicon with ultrahigh aspect ratio Xu CK, Zhang X, Tu KN, Xie YH Journal of the Electrochemical Society, 154(3), D170, 2007 |
| 7 |
Immersion nickel deposition on blank silicon in aqueous solution containing ammonium fluoride Zhang X, Chen Z, Tu KN Thin Solid Films, 515(11), 4696, 2007 |
| 8 |
Single-step fabrication of nickel films with arrayed macropores and nanostructured skeletons Zhang X, Tu KN, Xie YH, Tung CH, Xu SY Advanced Materials, 18(14), 1905, 2006 |
| 9 |
High aspect ratio nickel structures fabricated by electrochemical replication of hydrofluoric acid etched silicon Zhang X, Tu KN, Xie YH, Tung CH Electrochemical and Solid State Letters, 9(9), C150, 2006 |
| 10 |
Preparation of hierarchically porous nickel from macroporous silicon Zhang X, Tu KN Journal of the American Chemical Society, 128(47), 15036, 2006 |