검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints Wu PL, Huang MK, Lee C, Tzan SR Journal of the Chinese Institute of Chemical Engineers, 35(5), 571, 2004 |
| 2 |
Failure behavior of small outline J lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test Wu PL, Huang MK, Lee C, Tzan SR Materials Chemistry and Physics, 87(2-3), 285, 2004 |