| 1 |
Organic and organic-inorganic hybrid polymer thin films deposited by PECVD using TEOS and cyclohexene for ULSI interlayer-dielectric application
Seo HJ, Nam SH, Kim S, Boo JH
Applied Surface Science, 354, 134, 2015 |
| 2 |
Study of porogen removal by atomic hydrogen generated by hot wire chemical vapor deposition for the fabrication of advanced low-k thin films
Godavarthi S, Wang C, Verdonck P, Matsumoto Y, Koudriavtsev I, Dutt A, Tielens H, Baklanov MR
Thin Solid Films, 575, 103, 2015 |
| 3 |
Ultra low-dielectric-constant methylated mesoporous silica films with high hydrophobicity and stability
Yuan H, Xu JQ, Xie LL
Materials Chemistry and Physics, 129(3), 1195, 2011 |
| 4 |
Application of scatterometric porosimetry to characterize porous ultra low-k patterned layers
Licitra C, Bouyssou R, El Kodadi M, Haberfehlner G, Chevolleau T, Hazart J, Virot L, Besacier M, Schiavone P, Bertin F
Thin Solid Films, 519(9), 2825, 2011 |
| 5 |
Architectural optimization of porous Ultra Low K dielectric material via Finite Element simulations
Jauffres D, Dendievel R, Verdier M
Thin Solid Films, 520(1), 430, 2011 |
| 6 |
Multi-solvent ellipsometric porosimetry analysis of plasma-treated porous SiOCH films
Licitra C, Bouyssou R, Chevolleau T, Bertin F
Thin Solid Films, 518(18), 5140, 2010 |
| 7 |
Structural study of nanoporous ultra low-k dielectrics using complementary techniques: Ellipsometric porosimetry, X-ray reflectivity and grazing incidence small-angle X-ray scattering
Jousseaume V, Rolland G, Babonneau D, Simon JP
Applied Surface Science, 254(2), 473, 2007 |
| 8 |
Chemically reactive nanoparticle for ultra-low k applications
Shin JJ, Park SJ, Min SK, Rhee HW, Moon B, Yoon DY
Molecular Crystals and Liquid Crystals, 445, 167, 2006 |
| 9 |
Ta/SiCN bilayer barrier for Cu-ultra low k integration
Zhang DH, Yang LY, Li CY, Lu PW, Foo PD
Thin Solid Films, 504(1-2), 235, 2006 |
| 10 |
Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration
Yang LY, Zhang DH, Li CY, Liu R, Lu PW, Foo PD, Wee ATS
Thin Solid Films, 504(1-2), 265, 2006 |
