화학공학소재연구정보센터
검색결과 : 3건
No. Article
1 Planar copper plating and electropolishing techniques
Basol BM, Uzoh CE, Talieh H, Wang T, Guo G, Erdemli S, Cornejo M, Bogart J, Basol EC
Chemical Engineering Communications, 193(7), 903, 2006
2 Planarization efficiency of electrochemical mechanical deposition and its dependence on process parameters
Basol BM, Erdemli S, Uzoh CE, Wang T
Journal of the Electrochemical Society, 153(3), C176, 2006
3 Characterization of copper layers grown by electrochemical mechanical deposition technique
Wang T, Lindquist P, Erdemli S, Basol EC, Zhang R, Uzoh CE, Basol BM
Thin Solid Films, 478(1-2), 345, 2005