검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging Murali S, Srikanth N, Wong YM, Vath CJ Journal of Materials Science, 42(2), 615, 2007 |
| 2 |
Adhesion improvement of EMC-leadframe interface using brown oxide promoters Srikanth N, Chan L, Vath CJ Thin Solid Films, 504(1-2), 397, 2006 |
| 3 |
Critical study of thermosonic copper ball bonding Srikanth N, Murali S, Wong YM, Vath CJ Thin Solid Films, 462-63, 339, 2004 |
| 4 |
Development of compliant coating system for transfer molding of sensitive silicon dice Srikanth N, Kuah TH, Ho SC, Vath CJ Thin Solid Films, 462-63, 459, 2004 |
| 5 |
An analysis of intermetallics formation of gold and copper ball bonding on thermal aging Murali S, Srikanth N, Vath CJ Materials Research Bulletin, 38(4), 637, 2003 |