| 1 |
Test particle simulation of the role of ballistic electrons in hybrid dc/rf capacitively coupled CF4 plasmas
Ventzek PLG, Denpoh K
Journal of Vacuum Science & Technology A, 27(2), 287, 2009 |
| 2 |
Test particle simulation of the role of ballistic electrons in hybrid dc/rf capacitively coupled plasmas in argon
Denpoh K, Ventzek PLG
Journal of Vacuum Science & Technology A, 26(6), 1415, 2008 |
| 3 |
Tantalum carbide etch characterization in inductively coupled Ar/Cl-2/HBr plasmas
Kawai H, Rauf S, Luckowski E, Ventzek PLG
Journal of Vacuum Science & Technology A, 24(5), 1764, 2006 |
| 4 |
Modeling dual inlaid feature construction
Stout PJ, Rauf S, Nagy A, Ventzek PLG
Journal of Vacuum Science & Technology B, 24(3), 1344, 2006 |
| 5 |
Gate etch process model for static random access memory bit cell and FinFET construction
Stout PJ, Rauf S, Peters RD, Ventzek PLG
Journal of Vacuum Science & Technology B, 24(4), 1810, 2006 |
| 6 |
Modeling HfO2 atomic layer chemical vapor deposition on blanket wafer, via, and trench structures using HfCl4/H2O
Stout PJ, Adams V, Ventzek PLG
Journal of Vacuum Science & Technology B, 24(5), 2372, 2006 |
| 7 |
Plasma and process characterization of high power magnetron physical vapor deposition with integrated plasma equipment-feature profile model
Zhang D, Stout PJ, Ventzek PLG
Journal of Vacuum Science & Technology A, 21(1), 265, 2003 |
| 8 |
Modeling high power magnetron copper seed deposition: Effect of feature geometry on coverage
Stout PJ, Zhang D, Ventzek PLG
Journal of Vacuum Science & Technology A, 21(3), 596, 2003 |
| 9 |
Integrated equipment-feature modeling investigation of fluorocarbon plasma etching of SiO2 and photoresist
Zhang D, Rauf S, Sparks TG, Ventzek PLG
Journal of Vacuum Science & Technology B, 21(2), 828, 2003 |
| 10 |
Application and simulation of low temperature plasma processes in semiconductor manufacturing
Ventzek PLG, Rauf S, Stout PJ, Zhang D, Dauksher W, Hall E
Applied Surface Science, 192(1-4), 201, 2002 |
