화학공학소재연구정보센터
검색결과 : 9건
No. Article
1 Fracture strength of silicon wafers sawn by fixed diamond wire saw
Liu TY, Ge PQ, Bi WB, Wang PZ
Solar Energy, 157, 427, 2017
2 The impact of wafering on organic and inorganic surface contaminations
Meyer S, Wahl S, Timmel S, Kopge R, Jang BY
Applied Surface Science, 378, 384, 2016
3 Detailed statistical contact angle analyses; "slow moving" drops on inclining silicon-oxide surfaces
Schmitt M, Gross K, Grub J, Heib F
Journal of Colloid and Interface Science, 447, 229, 2015
4 Statistical contact angle analyses; "slow moving" drops on a horizontal silicon-oxide surface
Schmitt M, Grub J, Heib F
Journal of Colloid and Interface Science, 447, 248, 2015
5 Silicon surface passivation by hot-wire CVD Si thin films studied by in situ surface spectroscopy
Gielis JJH, Hoex B, van den Oever PJ, de Sanden MCMV, Kessels WMM
Thin Solid Films, 517(12), 3456, 2009
6 Impact of iron contamination and roughness generated in ammonia hydrogen peroxide mixtures (SC1) on 5 nm gate oxides
De Gendt S, Knotter DM, Kenis K, Mertens PW, Heyns MM
Journal of the Electrochemical Society, 145(7), 2589, 1998
7 The Prevention of Si Pitting in Hydrofluoric-Acid Cleaning by Additions of Hydrochloric-Acid
Chung BC, Marshall GA, Pearce CW, Yanders KP
Journal of the Electrochemical Society, 144(2), 652, 1997
8 Electrochemical Investigation of Copper Contamination on Silicon-Wafers from HF Solutions
Jeon JS, Raghavan S, Parks HG, Lowell JK, Ali I
Journal of the Electrochemical Society, 143(9), 2870, 1996
9 Total Room-Temperature Wet Cleaning for Si Substrate Surface
Ohmi T
Journal of the Electrochemical Society, 143(9), 2957, 1996