검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Electrical conduction and TDDB reliability characterization for low-k SiCO dielectric in Cu interconnects Wang RCJ, Chang-Liao KS, Wang TK, Chang MN, Wang CS, Lin CH, Lee CC, Chiu CC, Wu K Thin Solid Films, 517(3), 1230, 2008 |
| 2 |
Resistance characterization of Cu stress-induced void migration at narrow metal finger connected with wide lead Wang RCJ, Chang-Liao KS, Wang TK, Lee CC, Lin JH, Oates AS, Lee SC, Wu K Thin Solid Films, 516(2-4), 449, 2007 |