화학공학소재연구정보센터
검색결과 : 3건
No. Article
1 Inductively coupled hydrogen plasma-assisted Cu ALD on metallic and dielectric surfaces
Jezewski C, Lanford WA, Wiegand CJ, Singh JP, Wang PI, Senkevich JJ, Lu TM
Journal of the Electrochemical Society, 152(2), C60, 2005
2 Correlation between bond cleavage in parylene N and the degradation of its dielectric properties
Senkevich JJ, Mallikarjunan A, Wiegand CJ, Lu TM, Bani-Salameh HN, Lichti RL
Electrochemical and Solid State Letters, 7(4), G56, 2004
3 Molecular caulking - A pore sealing CVD polymer for ultralow k dielectrics
Jezewski C, Wiegand CJ, Ye DX, Mallikarjunan A, Liu DL, Jin CM, Lanford WA, Wang GC, Senkevich JJ, Lu TM
Journal of the Electrochemical Society, 151(7), F157, 2004