검색결과 : 3건
No. | Article |
---|---|
1 |
Inductively coupled hydrogen plasma-assisted Cu ALD on metallic and dielectric surfaces Jezewski C, Lanford WA, Wiegand CJ, Singh JP, Wang PI, Senkevich JJ, Lu TM Journal of the Electrochemical Society, 152(2), C60, 2005 |
2 |
Correlation between bond cleavage in parylene N and the degradation of its dielectric properties Senkevich JJ, Mallikarjunan A, Wiegand CJ, Lu TM, Bani-Salameh HN, Lichti RL Electrochemical and Solid State Letters, 7(4), G56, 2004 |
3 |
Molecular caulking - A pore sealing CVD polymer for ultralow k dielectrics Jezewski C, Wiegand CJ, Ye DX, Mallikarjunan A, Liu DL, Jin CM, Lanford WA, Wang GC, Senkevich JJ, Lu TM Journal of the Electrochemical Society, 151(7), F157, 2004 |