| 1 |
Comparison of ultrasonic wire bonding process between gold and copper by nonlinear structure analysis
Pan YJ, Zhu FL, Lin XX, Fan JJ, Liu S
Journal of Adhesion Science and Technology, 32(18), 2007, 2018 |
| 2 |
ZnO nanorod arrays and direct wire bonding on GaN surfaces for rapid fabrication of antireflective, high-temperature ultraviolet sensors
So HY, Senesky DG
Applied Surface Science, 387, 280, 2016 |
| 3 |
Integration of GMR-based spin torque oscillators and CMOS circuitry
Chen T, Eklund A, Sani S, Rodriguez S, Malm BG, Akerman J, Rusu A
Solid-State Electronics, 111, 91, 2015 |
| 4 |
Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads
Anand TJS, Yau CK, Leong YS, Keat LW, Ting HM
Current Applied Physics, 13(8), 1674, 2013 |
| 5 |
On the wire sweep experiments and predictions of gold wire for semiconductor wirebonding technology
Kung HK, Huang BW
Materials Science Forum, 505-507, 319, 2006 |
| 6 |
SiC power device packaging technologies for 300 to 350 degrees C applications
Johnson RW, Williams J
Materials Science Forum, 483, 785, 2005 |
| 7 |
Critical study of thermosonic copper ball bonding
Srikanth N, Murali S, Wong YM, Vath CJ
Thin Solid Films, 462-63, 339, 2004 |
| 8 |
Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass
Hsieh JH, Wu TM, Tong JZ, Yang YS
Journal of Adhesion Science and Technology, 17(15), 2085, 2003 |
| 9 |
Novel pad structures for the improvement of wire bonding strength in DXD panel
Choo KS, Kim KJ, Ahn BC
Current Applied Physics, 2(3), 257, 2002 |
| 10 |
Smart ultrasonic transducer for wire-bonding applications
Chu PWP, Li HL, Chan HLW, Ng KMW, Liu PCK
Materials Chemistry and Physics, 75(1-3), 95, 2002 |
