화학공학소재연구정보센터
검색결과 : 7건
No. Article
1 Interface stability in advanced high-kappa-metal-gate stacks
Adelmann C, Franquet A, Conard T, Witters T, Ferain I, Meersschaut J, Jurczak M, De Meyer K, Kittl JA, Van Elshocht S
Journal of Vacuum Science & Technology B, 27(3), 1021, 2009
2 Investigation on molybdenum and its conductive oxides as p-type metal gate candidates
Li Z, Schram T, Witters T, Cho HJ, O'Sullivan B, Yamada N, Takaaki T, Hooker J, De Gendt S, De Meyer K
Journal of the Electrochemical Society, 155(7), H481, 2008
3 Aqueous chemical solution deposition - Fast screening method for alternative high-k materials applied to Nd2O3
Van Elshocht S, Hardy A, Witters T, Adelmann C, Caymax M, Conard T, De Gendt S, Franquet A, Richard O, Van Bael MK, Mullens J, Heyns M
Electrochemical and Solid State Letters, 10(4), G15, 2007
4 Evaluation of atomic layer deposited NbN and NbSiN as metal gate materials
Van Hoornick N, De Witte H, Witters T, Zhao C, Conard T, Huotari H, Swerts J, Schram T, Maes JW, De Gendt S, Heyns M
Journal of the Electrochemical Society, 153(5), G437, 2006
5 Metallorganic chemical vapor deposition of dysprosium scandate high-k layers using mmp-type precursors
Van Elshocht S, Lehnen P, Seitzinger B, Abrutis A, Adelmann C, Brijs B, Caymax M, Conard T, De Gendt S, Franquet A, Lohe C, Lukosius M, Moussa A, Richard O, Williams P, Witters T, Zimmerman P, Heyns M
Journal of the Electrochemical Society, 153(9), F219, 2006
6 Bulk properties of MOCVD-deposited HfO2 layers fair high k dielectric applications
Van Elshocht S, Baklanov M, Brijs B, Carter R, Caymax M, Carbonell L, Claes M, Conard T, Cosnier V, Date L, De Gendt S, Kluth J, Pique D, Richard O, Vanhaeren D, Vereecke G, Witters T, Zhao C, Heyns M
Journal of the Electrochemical Society, 151(10), F228, 2004
7 Effect of postdeposition anneal conditions on defect density of HfO2 layers measured by wet etching
Claes M, De Gendt S, Witters T, Kaushik V, Conard T, Zhao C, Manabe Y, Delabie A, Rohr E, Chen J, Tsai W, Heyns MM
Journal of the Electrochemical Society, 151(11), F269, 2004