검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Synergistic Toughening of Epoxy-Copper Interface Using a Thiol-Based Coupling Layer Wong CKY, Leung SYY, Fan HB, Yuen MMF Journal of Adhesion Science and Technology, 25(16), 2081, 2011 |
| 2 |
A multi-scale method to investigate delamination in electronic packages Fan HB, Wong CKY, Yuen MMF Journal of Adhesion Science and Technology, 20(10), 1061, 2006 |
| 3 |
Investigation of moisture diffusion in electronic packages by molecular dynamics simulation Fan HB, Chan EKL, Wong CKY, Yuen MMF Journal of Adhesion Science and Technology, 20(16), 1937, 2006 |