| 1 |
Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation
Diyatmika W, Chu JP, Yen YW, Chang WZ, Hsueh CH
Thin Solid Films, 561, 93, 2014 |
| 2 |
Interfacial reactions in the Sn-xBi/Au couples
Yen YW, Liou WK, Chen CM, Lin CK, Huang MK
Materials Chemistry and Physics, 128(1-2), 233, 2011 |
| 3 |
Electroenhanced metallorganic chemical vapor deposition of copper films
Kuo L, Lee C, Chen G, Liu KL, Yen YW
Electrochemical and Solid State Letters, 10(5), D51, 2007 |
| 4 |
A DSC study on the kinetics of disproportionation reaction of (hfac)Cu-I(COD)
Chen G, Lee C, Kuo YL, Yen YW
Thermochimica Acta, 456(2), 89, 2007 |
| 5 |
Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor-liquid crystal display applications
Yen YW, Kuo YL, Chen JY, Lee CP, Lee CY
Thin Solid Films, 515(18), 7209, 2007 |
| 6 |
The activation effect of Pd nanoparticles on electroless nickel-phosphorous deposition
Kuo LC, Huang YC, Lee CL, Yen YW
Electrochimica Acta, 52(1), 353, 2006 |
| 7 |
A novel two-step MOCVD for producing thin copper films with a mixture of ethyl alcohol and water as the additive
Lee HH, Lee C, Kuo YL, Yen YW
Thin Solid Films, 498(1-2), 43, 2006 |
| 8 |
Reaction mechanism of the two-step MOCVD of copper thin film using Cu(hfac)(2)center dot H2O source
Lee C, Lee HH, Yen YW, Kuo YL
Electrochemical and Solid State Letters, 8(11), G307, 2005 |
| 9 |
Evaluation of the thermal stability of reactively sputtered (Ti, Zr)N-x nano-thin films as diffusion barriers between Cu and silicon
Kuo YL, Lee C, Lin JC, Yen YW, Lee WH
Thin Solid Films, 484(1-2), 265, 2005 |
| 10 |
Nickel and copper deposition on fine alumina particles by using the chemical vapor deposition-circulation fluidized bed reactor technique
Yen YW, Chen SW
Journal of Materials Science, 35(6), 1439, 2000 |
