화학공학소재연구정보센터
검색결과 : 13건
No. Article
1 Glass transition behavior of ternary disaccharide-ethylene glycol-water solutions
Yu TX, Zhao LS, Wang QA, Cao ZX
Chemical Physics Letters, 677, 172, 2017
2 An electrochemical biosensor for highly sensitive detection of microRNA-377 based on strand displacement amplification coupled with three-way junction
Hu R, Wang GL, Yuan R, Xu YJ, Yu TX, Zhong L, Zhou Q, Ding SJ
Journal of Electroanalytical Chemistry, 789, 160, 2017
3 Growth of nano- and microcrystalline silicon thin films at low temperature by pulsed electron deposition
Lu NP, Liao LG, Zhang WB, Yu TX, Ji AL, Cao ZX
Journal of Crystal Growth, 375, 67, 2013
4 Fabrication of Novel Superhydrophobic Surfaces and Droplet Bouncing Behavior - Part 2: Water Droplet Impact Experiment on Superhydrophobic Surfaces Constructed Using ZnO Nanoparticles
Wang BB, Zhao YP, Yu TX
Journal of Adhesion Science and Technology, 25(1-3), 93, 2011
5 Fabrication of Novel Superhydrophobic Surfaces and Water Droplet Bouncing Behavior - Part 1: Stable ZnO-PDMS Superhydrophobic Surface with Low Hysteresis Constructed Using ZnO Nanoparticles
Wang BB, Feng JT, Zhao YP, Yu TX
Journal of Adhesion Science and Technology, 24(15-16), 2693, 2010
6 A novel chemical-defined medium with bFGF and N2B27 supplements supports undifferentiated growth in human embryonic stem cells
Liu YX, Song ZH, Zhao Y, Qin H, Cai J, Zhang H, Yu TX, Jiang SM, Wang GW, Ding MX, Deng HK
Biochemical and Biophysical Research Communications, 346(1), 131, 2006
7 Ultra-strong gel-spun UHMWPE fibers reinforced using multiwalled carbon nanotubes
Ruan SL, Gao P, Yu TX
Polymer, 47(5), 1604, 2006
8 Characteristic of microscopic shape memory effect in a CuAlNi alloy by nanoindentation
Liu C, Zhao YP, Sun QP, Yu TX, Cao ZX
Journal of Materials Science, 40(6), 1501, 2005
9 Crushing and fragmentation of brittle spheres under double impact test
Wu SZ, Chau KT, Yu TX
Powder Technology, 143-4, 41, 2004
10 Mechanics of adhesion in MEMS - a review
Zhao YP, Wang LS, Yu TX
Journal of Adhesion Science and Technology, 17(4), 519, 2003