| 1 |
Novel sandwich-structured composite pellicle displays high and tuned electrically conductive anisotropy, magnetism and photoluminescence
Yang L, Ma QL, Xi X, Li D, Liu JY, Dong XT, Yu WS, Wang JX, Liu GX
Chemical Engineering Journal, 361, 713, 2019 |
| 2 |
Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)
Hong MH, Kim SC, Kim YH
Current Applied Physics, 12(3), 612, 2012 |
| 3 |
Material Properties and Reliability of Anisotropic Conductive Films (ACFs) Modified by POSS for Chip-on-Glass Assembly
Hwang JS, Kim JY, Ku DY, Kwon OH, Kwon Y
Molecular Crystals and Liquid Crystals, 550, 83, 2011 |
| 4 |
Effect of Material Properties of Anisotropic Conductive Films (ACFs) on the Reliability of Chip-On-Glass (COG) Assembly
Hwang JS, Kim JY, Ku DY, Shin KS, Jeong YC, Kwon Y, Kwon OH
Molecular Crystals and Liquid Crystals, 529, 122, 2010 |
| 5 |
에폭시 레진의 경화방법에 따른 이방성 전도필름의 접합신뢰성 및 열적기계적 특성 변화
길만석, 서경원, 김재한, 이종원, 장은희, 정도연, 김수자, 김정수
Polymer(Korea), 34(3), 191, 2010 |
| 6 |
Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films
Kim JW, Lee YC, Ko JH, Nah W, Jeong MY, Kwon HC, Jung SB
Journal of Adhesion Science and Technology, 22(13), 1339, 2008 |
| 7 |
Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding
Zenner RLD, Murray CT, Fisher C
Journal of Adhesion Science and Technology, 22(14), 1781, 2008 |
| 8 |
Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film
Kim JW, Jung SB
Journal of Adhesion Science and Technology, 21(11), 1071, 2007 |
| 9 |
Effects of hygrothermal aging on anisotropic conductive adhesive joints: experiments and theoretical analysis
Lin YC, Chen X, Wang ZP
Journal of Adhesion Science and Technology, 20(12), 1383, 2006 |
