| 1 |
In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions-Part 2: The transpassive state
Schneider M, Schroth S, Richter S, Hohn S, Schubert N, Michaelis A
Electrochimica Acta, 70, 76, 2012 |
| 2 |
In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions - Part 1: The active state
Schneider M, Schroth S, Richter S, Hohn S, Schubert N, Michaelis A
Electrochimica Acta, 56(22), 7628, 2011 |
| 3 |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution. Part I. Identification of products and reaction pathway
Bolzan AE, Haseeb ASMA, Schilardi PL, Piatti RCV, Salvarezza RC, Arvia AJ
Journal of Electroanalytical Chemistry, 500(1-2), 533, 2001 |
| 4 |
Anodisation of copper in thiourea-containing acid solution -Part II. In situ transversal imaging observations. Kinetics of anodic film growth
Haseeb ASMA, Schilardi PL, Bolzan AE, Piatti RCV, Salvarezza RC, Arvia AJ
Journal of Electroanalytical Chemistry, 500(1-2), 543, 2001 |
| 5 |
Copper dissolution phenomena along a vertical plane anode in CuSO4 solution
Konishi Y, Tanaka Y, Kondo Y, Fukunaka Y
Electrochimica Acta, 46(5), 681, 2000 |
| 6 |
Applications of Magnetoelectrolysis
Tacken RA, Janssen LJ
Journal of Applied Electrochemistry, 25(1), 1, 1995 |
| 7 |
Electrochemical Reaction Dynamics - A Review
Hudson JL, Tsotsis TT
Chemical Engineering Science, 49(10), 1493, 1994 |
