검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Patterned copper plating layer thickness made uniform by placement of auxiliary grid electrode about ball grid arrays Okubo T, Kodera T, Kondo K Chemical Engineering Communications, 193(12), 1503, 2006 |
| 2 |
Interfacial reaction between Sn-Ag based solders and Au/Ni alloy platings Uenishi K, Kobayashi KF Materials Science Forum, 502, 411, 2005 |
| 3 |
Effect of Zn-addition and structural transformation on the creep behaviour of Pb-10 wt.% Sn alloy El-Daly AA, Abdel-Daiem AM, Abdel-Rahman AN, Mohammed SM Materials Chemistry and Physics, 85(1), 163, 2004 |