검색결과 : 1건
No. | Article |
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1 |
Post-etch residue removal in BCB/Cu interconnection structure Hong YT, Kim YI, Lee MC, Park S, Shim D, Park CM, Hong BY, Roh Y, Jung SH, Song IS Thin Solid Films, 435(1-2), 238, 2003 |
No. | Article |
---|---|
1 |
Post-etch residue removal in BCB/Cu interconnection structure Hong YT, Kim YI, Lee MC, Park S, Shim D, Park CM, Hong BY, Roh Y, Jung SH, Song IS Thin Solid Films, 435(1-2), 238, 2003 |