| 1 |
Quadrature moment simulation of silica nanoparticles aggregation and breakage in chemical mechanical polishing
Choi SG, Im GT, Kim EC, Park KH, Kim TS
Journal of Industrial and Engineering Chemistry, 107, 207, 2022 |
| 2 |
Shape classification of fumed silica abrasive and its effects on chemical mechanical polishing
Kim E, Lee J, Park Y, Shin C, Yang J, Kim T
Powder Technology, 381, 451, 2021 |
| 3 |
Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers
Liu TT, Lei H
Applied Surface Science, 413, 16, 2017 |
| 4 |
Effects of non-spherical colloidal silica slurry on Al-NiP hard disk substrate CMP application
Salleh S, Sudin I, Awang A
Applied Surface Science, 360, 59, 2016 |
| 5 |
Performance of colloidal silica and ceria based slurries on CMP of Si-face 6H-SiC substrates
Chen GM, Ni ZF, Xu LJ, Li QZ, Zhao YW
Applied Surface Science, 359, 664, 2015 |
| 6 |
XPS, UV-vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)
Zhou Y, Pan GS, Shi XL, Xu L, Zou CL, Gong H, Luo GH
Applied Surface Science, 316, 643, 2014 |
| 7 |
First observation on the feasibility of scratch formation by pad-particle mixture in CMP process
Sung IH, Kim HJ, Yeo CD
Applied Surface Science, 258(20), 8298, 2012 |
| 8 |
Preparation of copper-incorporated mesoporous alumina abrasive and its CMP behavior on hard disk substrate
Lei H, Jiang L, Chen RL
Powder Technology, 219, 99, 2012 |
| 9 |
Preparation of porous alumina abrasives and their chemical mechanical polishing behavior
Lei H, Wu X, Chen RL
Thin Solid Films, 520(7), 2868, 2012 |
| 10 |
Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)
Xu WH, Lu XC, Pan GS, Lei YZ, Luo JB
Applied Surface Science, 257(7), 2905, 2011 |
