| 1 |
Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)
Hong MH, Kim SC, Kim YH
Current Applied Physics, 12(3), 612, 2012 |
| 2 |
Material Properties and Reliability of Anisotropic Conductive Films (ACFs) Modified by POSS for Chip-on-Glass Assembly
Hwang JS, Kim JY, Ku DY, Kwon OH, Kwon Y
Molecular Crystals and Liquid Crystals, 550, 83, 2011 |
| 3 |
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy
Jo JL, Lee JB, Kim JM, Shin YE, Jung SB
Journal of Adhesion, 86(5-6), 470, 2010 |
| 4 |
Effect of Material Properties of Anisotropic Conductive Films (ACFs) on the Reliability of Chip-On-Glass (COG) Assembly
Hwang JS, Kim JY, Ku DY, Shin KS, Jeong YC, Kwon Y, Kwon OH
Molecular Crystals and Liquid Crystals, 529, 122, 2010 |
| 5 |
Effects of hygrothermal aging on anisotropic conductive adhesive joints: experiments and theoretical analysis
Lin YC, Chen X, Wang ZP
Journal of Adhesion Science and Technology, 20(12), 1383, 2006 |
| 6 |
Chip-on-glass bonding using sn bump and non-conductive adhesive for LCD application
Kim BY, Chen ZG, Kim YH
Molecular Crystals and Liquid Crystals, 458, 199, 2006 |
| 7 |
Reaction between Sn-In solder and under bump metallurgy
Choi JH, Jung BY, Jun SW, Kim YH, Oh TS
Materials Science Forum, 449-4, 401, 2004 |
