| 1 |
Thermal Decomposition of Ammonium Perchlorate in the Presence of Copper Tungsten Oxide (CuWO4)
Jain S, Varma VK, Mahajan AK, Khire VH, Kandasubramanian B
Propellants Explosives Pyrotechnics, 46(5), 758, 2021 |
| 2 |
Thermal Decomposition of Ammonium Perchlorate in the Presence of Copper Tungsten Oxide (CuWO4)
Jain S, Varma VK, Mahajan AK, Khire VH, Kandasubramanian B
Propellants Explosives Pyrotechnics, 46(5), 758, 2021 |
| 3 |
Copper tungsten sulfide anchored on Ni-foam as a high-performance binder free negative electrode for asymmetric supercapacitor
Pazhamalai P, Krishnamoorthy K, Sahoo S, Mariappan VK, Kim SJ
Chemical Engineering Journal, 359, 409, 2019 |
| 4 |
Ternary copper-tungsten-disulfide nanocube inks as catalyst for highly efficient dye-sensitized solar cells
Gulen M, Sarilmaz A, Patir IH, Ozel F, Sonmezoglu S
Electrochimica Acta, 269, 119, 2018 |
| 5 |
The microstructure and properties of tungsten alloying layer on copper by high-current pulse electron beam
Zhang CL, Lv P, Cai J, Peng CT, Jin YX, Guan QF
Applied Surface Science, 422, 582, 2017 |
| 6 |
Microstructure and mechanical properties of metastable solid solution copper-tungsten films
Thomas K, Taylor AA, Raghavan R, Chawla V, Spolenak R, Michler J
Thin Solid Films, 642, 82, 2017 |
| 7 |
Laser fabrication of W-reinforced Cu layers: II. Electrical wear behavior in air and synthetic acid rain
Wong PK, Kwok CT, Man HC, Guo D
Materials Chemistry and Physics, 177, 118, 2016 |
| 8 |
Microstructure and mechanical properties of physical vapor deposited Cu/W nanoscale multilayers: Influence of layer thickness and temperature
Monclus MA, Karlik M, Callisti M, Frutos E, LLorca J, Polcar T, Molina-Aldareguia JM
Thin Solid Films, 571, 275, 2014 |
| 9 |
Tungsten as an interface agent leading to highly active and stable copper-ceria water gas shift catalyst
Kubacka A, Si R, Michorczyk P, Martinez-Arias A, Xu WQ, Hanson JC, Rodriguez JA, Fernandez-Garcia M
Applied Catalysis B: Environmental, 132, 423, 2013 |
| 10 |
Facile preparation of p-CuO and p-CuO/n-CuWO4 junction thin films and their photoelectrochemical properties
Zheng JY, Song G, Kim CW, Kang YS
Electrochimica Acta, 69, 340, 2012 |
