| 1 |
Surface modification of ABS by photocatalytic treatment for electroless copper plating
Zhao WX, Ma Q, Li LS, Li XR, Wang ZL
Journal of Adhesion Science and Technology, 28(5), 499, 2014 |
| 2 |
Surface modification of ABS by photocatalytic treatment for electroless copper plating
Zhao WX, Ma Q, Li LS, Li XR, Wang ZL
Journal of Adhesion Science and Technology, 28(5), 499, 2014 |
| 3 |
First principles simulations of 2D Cu superlattices on the MgO(001) surface
Zhukovskii YF, Kotomin EA, Fuks D, Dorfman S, Stoneham AM, Sychev O, Borstel G
Applied Surface Science, 226(1-3), 298, 2004 |
| 4 |
Adhesion between polyethylene molding and metal surface-modified with silane coupling agents by use of polyethylene gels
Fujimatsu H, Iyo K, Usami H, Ogasawara S, Kajiwara K
Composite Interfaces, 9(3), 259, 2002 |
| 5 |
Synthesis of polyimides containing triazole to improve their adhesion to copper substrate
Seo J, Kang J, Cho K, Park CE
Journal of Adhesion Science and Technology, 16(13), 1839, 2002 |
| 6 |
Protective flexible coatings on copper by spontaneous polymerization
Zheng HP, Nainani K, Bell JP
Journal of Applied Polymer Science, 85(8), 1749, 2002 |
| 7 |
Argon ion treatment of the Dow Cyclotene 3022 surface and its effect on the adhesion of evaporated copper
Yang DQ, Sacher E
Applied Surface Science, 173(1-2), 30, 2001 |
| 8 |
Interaction of copper atoms with surface graft-copolymerization poly(tetrafluoroethylene) film: an in situ X-ray photoelectron spectroscopic study
Wu SY, Kang ET, Neoh KG
Applied Surface Science, 174(3-4), 296, 2001 |
| 9 |
DEVELOPMENT AND THERMAL DURABILITY OF AN INTERFACIAL BOND BETWEEN ELECTROLESSLY DEPOSITED METALS AND A FLUORINATED POLYIMIDE
BAUMGARTNER CE, SCOTT LR
Journal of Adhesion Science and Technology, 9(7), 789, 1995 |
