검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure Roy A, Tan CM Thin Solid Films, 515(7-8), 3867, 2007 |
| 2 |
Copper electromigration modeling including barrier layer effect Wu W, Yuan JS Solid-State Electronics, 45(12), 2011, 2001 |
| 3 |
Applicability of ALE TiN films as Cu/Si diffusion barriers Kim DJ, Jung YB, Lee MB, Lee YH, Lee JH, Lee JH Thin Solid Films, 372(1-2), 276, 2000 |