| 1 |
Electrochemical aspects of tin electrodeposition on copper in acid solutions
Azpeitia LA, Gervasi CA, Bolzan AE
Electrochimica Acta, 298, 400, 2019 |
| 2 |
Development and application of a multipurpose electrodeposition cell configuration for studying plating processes on wafer specimen and for characterizing surface films by scanning electrochemical microscopy
Hanekamp P, Robl W, Matysik FM
Journal of Applied Electrochemistry, 47(12), 1305, 2017 |
| 3 |
Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor
Mu W, Fu YF, Sun SX, Edwards M, Ye LL, Jeppson K, Liu J
Chemical Engineering Journal, 304, 106, 2016 |
| 4 |
Electrochemical nucleation and growth of copper deposition onto FrO and n-Si(100) electrodes
Khelladi MR, Mentar L, Azizi A, Sahari A, Kahoul A
Materials Chemistry and Physics, 115(1), 385, 2009 |
| 5 |
The electrochemical nucleation of copper on disc-shaped ultramicroelectrode in industrial electrolyte
Gladysz O, Los P
Electrochimica Acta, 54(2), 801, 2008 |
| 6 |
Nucleation and growth of copper under combined charge transfer and diffusion limitations: Part I
Milchev A, Zapryanova T
Electrochimica Acta, 51(14), 2926, 2006 |
| 7 |
Nucleation and growth of copper under combined charge transfer and diffusion limitations - Part II
Milchev A, Zapryanova T
Electrochimica Acta, 51(23), 4916, 2006 |
| 8 |
Reaction and nucleation mechanisms of copper electrodeposition from ammoniacal solutions on vitreous carbon
Grujicic D, Pesic B
Electrochimica Acta, 50(22), 4426, 2005 |
| 9 |
Electrodeposition of copper: the nucleation mechanisms
Grujicic D, Pesic B
Electrochimica Acta, 47(18), 2901, 2002 |
| 10 |
The influence of some parameters on the surface roughness of thin copper foils using statistical analysis
Getrouw MA, Dutra AJB
Journal of Applied Electrochemistry, 31(12), 1359, 2001 |
