검색결과 : 5건
No. | Article |
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1 |
Direct fabrication of copper patterns by reactive inkjet printing Kim K, Ahn SI, Choi KC Current Applied Physics, 13(9), 1870, 2013 |
2 |
The pH-sensitive Pd nanoparticles as ink for ink-jet printing technology and electroless Cu metallic patterns on indium-doped tin oxide substrate Tseng CC, Lin Y, Liu TY, Nian YY, Wang MW, Ger MD Thin Solid Films, 536, 81, 2013 |
3 |
Preparation and characterization of copper patterns on polyethylenimine-modified flexible substrates Su W, Li PY, Yang F, Liang LF, Huo LN, Tang H Reactive & Functional Polymers, 71(9), 943, 2011 |
4 |
Selective electroless copper deposition on aluminum nitride substrate with patterned copper seed layer Yanagimoto H, Deki S, Akamatsu K, Gotoh K Thin Solid Films, 491(1-2), 18, 2005 |
5 |
A new formulation for the elastic-viscoplastic lower bound and intermediate modeling for polycrystalline plasticity Ahzi S, M'Guil S, Agah-Tehrani A Materials Science Forum, 408-4, 463, 2002 |