화학공학소재연구정보센터
검색결과 : 5건
No. Article
1 Direct fabrication of copper patterns by reactive inkjet printing
Kim K, Ahn SI, Choi KC
Current Applied Physics, 13(9), 1870, 2013
2 The pH-sensitive Pd nanoparticles as ink for ink-jet printing technology and electroless Cu metallic patterns on indium-doped tin oxide substrate
Tseng CC, Lin Y, Liu TY, Nian YY, Wang MW, Ger MD
Thin Solid Films, 536, 81, 2013
3 Preparation and characterization of copper patterns on polyethylenimine-modified flexible substrates
Su W, Li PY, Yang F, Liang LF, Huo LN, Tang H
Reactive & Functional Polymers, 71(9), 943, 2011
4 Selective electroless copper deposition on aluminum nitride substrate with patterned copper seed layer
Yanagimoto H, Deki S, Akamatsu K, Gotoh K
Thin Solid Films, 491(1-2), 18, 2005
5 A new formulation for the elastic-viscoplastic lower bound and intermediate modeling for polycrystalline plasticity
Ahzi S, M'Guil S, Agah-Tehrani A
Materials Science Forum, 408-4, 463, 2002