| 1 |
Microscale chemical and electrostatic surface patterning of Dow Cyclotene by N-2 plasma
Yang DQ, Poulin S, Martinu L, Klemberg-Sapieha JE, Zabeida O, Sacher E
Applied Surface Science, 242(3-4), 419, 2005 |
| 2 |
Investigation of dow cyclotene 4026 surface amination by downstream plasma treatment
Wang LJ, Raupp G
Journal of Applied Polymer Science, 97(6), 2418, 2005 |
| 3 |
Cu cluster adhesion enhancement on the modified Dow Cyclotene surface through low energy N-2(+) beam irradiation at grazing angles
Yang DQ, Sacher E
Applied Surface Science, 207(1-4), 1, 2003 |
| 4 |
Local surface cleaning and cluster assembly using contact mode atomic force microscopy
Yang DQ, Sacher E
Applied Surface Science, 210(3-4), 158, 2003 |
| 5 |
The surface modification of Dow Cyclotene by low energy N-2(+) beams and its effect on the adhesion of evaporated Cu films
Yang DQ, Sacher E
Applied Surface Science, 195(1-4), 202, 2002 |
| 6 |
Argon ion treatment of the Dow Cyclotene 3022 surface and its effect on the adhesion of evaporated copper
Yang DQ, Sacher E
Applied Surface Science, 173(1-2), 30, 2001 |
| 7 |
Nitrogen plasma treatment of the dow Cyclotene 3022 surface and its reaction with evaporated copper
Yang DQ, Martinu L, Sacher E, Sadough-Vanini A
Applied Surface Science, 177(1-2), 85, 2001 |
| 8 |
The enhancement of the adhesion of copper layers to Dow Cyclotene 3022 through metal sputtering
Yang DQ, Sacher E, Griswold EM, Smith G
Applied Surface Science, 180(3-4), 200, 2001 |
| 9 |
The adhesion of evaporated copper to Dow Cyclotene 3022 (R), determined by microscratch testing
Sadough-Vanini A, Yang DQ, Martinu L, Sacher E
Journal of Adhesion, 77(4), 309, 2001 |
| 10 |
The surface structure of Dow Cyclotene 3022, as determined by photoacoustic FTIR, confocal Raman and photoelectron spectroscopies
Poulin S, Yang DQ, Sacher E, Hyett C, Ellis TH
Applied Surface Science, 165(1), 15, 2000 |
