검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Texture investigation in Cu damascene interconnects during annealing Cho JY, Lee HJ, Kim H, Szpunar JA Materials Science Forum, 495-497, 1377, 2005 |
| 2 |
Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology Li CY, Zhang DH, Su SS, Lu PW, He X, Jia GJ, Chen Z, Wu SY, Kumar R Thin Solid Films, 462-63, 172, 2004 |