| 1 |
비닐 아세테이트 기반의 쿨 오프 타입 온도감응성 점착제의 제조 및 특성조사
주윤석, 차재령, 공명선
Polymer(Korea), 42(5), 729, 2018 |
| 2 |
The effect of different dicing methods on the leakage currents of n-type silicon diodes and strip sensors
Christophersen M, Fadeyev V, Ely S, Phlips BF, Sadrozinski HFW
Solid-State Electronics, 81, 8, 2013 |
| 3 |
Adhesion Performance and UV-Curing Behaviors of Interpenetrated Structured Pressure Sensitive Adhesives with 3-MPTS for Si-Wafer Dicing Process
Lee SW, Park JW, Lee YH, Kim HJ, Rafailovich M, Sokolov J
Journal of Adhesion Science and Technology, 26(10-11), 1629, 2012 |
| 4 |
Utilization of TXRF analytical technique in order to improve front-end semiconductor processing
Budri T
Applied Surface Science, 254(15), 4768, 2008 |
| 5 |
Chemically modified symmetric and asymmetric duplex RNAs: An enhanced stability to nuclease degradation and gene silencing effect
Kubo T, Zhelev Z, Ohba H, Bakalova R
Biochemical and Biophysical Research Communications, 365(1), 54, 2008 |
| 6 |
Impact of laser scribing for efficient device separation of LED components
Illy EK, Knowles M, Gu E, Dawson MD
Applied Surface Science, 249(1-4), 354, 2005 |
| 7 |
UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes
Ebe K, Seno H, Horigome K
Journal of Applied Polymer Science, 90(2), 436, 2003 |
