검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee WS, Han IY, Yu J, Kim SJ, Byun KY Thermochimica Acta, 455(1-2), 148, 2007 |
| No. | Article |
|---|---|
| 1 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee WS, Han IY, Yu J, Kim SJ, Byun KY Thermochimica Acta, 455(1-2), 148, 2007 |