화학공학소재연구정보센터
검색결과 : 18건
No. Article
1 A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation
Wang CX, Xu JK, Guo S, Kang QS, Wang Y, Wang YP, Tian YH
Applied Surface Science, 471, 196, 2019
2 Large-area mechanical interlocking via nanopores: Ultra-high-strength direct bonding of polymer and metal materials
Xie Y, Zhang JH, Zhou T
Applied Surface Science, 492, 558, 2019
3 Glass-on-LiNbO3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method
Xu JK, Wang CX, Tian YH, Wu B, Wang S, Zhang H
Applied Surface Science, 459, 621, 2018
4 General multilayer heat transfer model for optical-based thermal characterization techniques
Feng XH, King C, Narumanchi S
International Journal of Heat and Mass Transfer, 93, 695, 2016
5 Process parameters influence on mechanical strength of direct bonded surfaces for both materials: silica and Zerodur((R)) glasses
Cocheteau N, Maurel-Pantel A, Lebon F, Rosu I, Prieto E, Ait-Zaid S, De Larclause IS, Salaun Y
Journal of Adhesion Science and Technology, 28(10), 915, 2014
6 Effects of homogenous loading on silicon direct bonding
Huang LY, Ho KL, Hu CT
Applied Surface Science, 257(17), 7693, 2011
7 Influence of microwave annealing on direct bonded silicon wafers
Alford TL, Tang T, Thompson DC, Bhagat S, Mayer JW
Thin Solid Films, 516(8), 2158, 2008
8 높은 열처리 온도를 갖는 GOI 웨이퍼의 직접접합
변영태, 김선호
Korean Journal of Materials Research, 16(10), 652, 2006
9 Synthesis of cobalt adhesion promoters and their evaluation in a passenger radial-belt skim compound
Mandal N, Sajith P, Agrawal SL, Bandyopadhyay S, Mukhopadhyay R
Journal of Adhesion, 81(9), 911, 2005
10 Improved characterization methods for unipolar directly bonded semiconductor junctions
Stuchinsky VA, Kamaev GN, Khoroshilov KY
Solid-State Electronics, 49(1), 9, 2005