검색결과 : 18건
No. | Article |
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1 |
A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation Wang CX, Xu JK, Guo S, Kang QS, Wang Y, Wang YP, Tian YH Applied Surface Science, 471, 196, 2019 |
2 |
Large-area mechanical interlocking via nanopores: Ultra-high-strength direct bonding of polymer and metal materials Xie Y, Zhang JH, Zhou T Applied Surface Science, 492, 558, 2019 |
3 |
Glass-on-LiNbO3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method Xu JK, Wang CX, Tian YH, Wu B, Wang S, Zhang H Applied Surface Science, 459, 621, 2018 |
4 |
General multilayer heat transfer model for optical-based thermal characterization techniques Feng XH, King C, Narumanchi S International Journal of Heat and Mass Transfer, 93, 695, 2016 |
5 |
Process parameters influence on mechanical strength of direct bonded surfaces for both materials: silica and Zerodur((R)) glasses Cocheteau N, Maurel-Pantel A, Lebon F, Rosu I, Prieto E, Ait-Zaid S, De Larclause IS, Salaun Y Journal of Adhesion Science and Technology, 28(10), 915, 2014 |
6 |
Effects of homogenous loading on silicon direct bonding Huang LY, Ho KL, Hu CT Applied Surface Science, 257(17), 7693, 2011 |
7 |
Influence of microwave annealing on direct bonded silicon wafers Alford TL, Tang T, Thompson DC, Bhagat S, Mayer JW Thin Solid Films, 516(8), 2158, 2008 |
8 |
높은 열처리 온도를 갖는 GOI 웨이퍼의 직접접합 변영태, 김선호 Korean Journal of Materials Research, 16(10), 652, 2006 |
9 |
Synthesis of cobalt adhesion promoters and their evaluation in a passenger radial-belt skim compound Mandal N, Sajith P, Agrawal SL, Bandyopadhyay S, Mukhopadhyay R Journal of Adhesion, 81(9), 911, 2005 |
10 |
Improved characterization methods for unipolar directly bonded semiconductor junctions Stuchinsky VA, Kamaev GN, Khoroshilov KY Solid-State Electronics, 49(1), 9, 2005 |