1 |
Investigating the effect of single and hybrid nanoparticles on melting of phase change material in a rectangular enclosure with finite heat source Faraji H, El Alami M, Arshad A International Journal of Energy Research, 45(3), 4314, 2021 |
2 |
PMMA의 현탁 및 유화 공중합에 의한 아이코산의 미세캡슐화:공단량체 및 가교제의 영향에 대한 정성적 분석 최보나, 김정수 Polymer(Korea), 43(1), 156, 2019 |
3 |
Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison Ali HM, Arshad A, Jabbal M, Verdin PG International Journal of Heat and Mass Transfer, 117, 1199, 2018 |
4 |
Thermal performance of LHSU for electronics under steady and transient operations modes Ali HM, Arshad A, Janjua MM, Baig W, Sajjad U International Journal of Heat and Mass Transfer, 127, 1223, 2018 |
5 |
Explaining the "anomalous" transient hot wire-based thermal conductivity measurements near solid-liquid phase change in terms of solid-solid transition Bin Hoque MS, Ansari N, Khodadadi JM International Journal of Heat and Mass Transfer, 125, 210, 2018 |
6 |
Microencapsulated n-eicosane PCM suspensions: Thermophysical properties measurement and modeling Ho CJ, Chang PC, Yan WM, Amani M International Journal of Heat and Mass Transfer, 125, 792, 2018 |
7 |
Synthesis and characterization of micro-nanoencapsulated n-eicosane with PMMA shell as novel phase change materials for thermal energy storage Rezvanpour M, Hasanzadeh M, Azizi D, Rezvanpour A, Alizadeh M Materials Chemistry and Physics, 215, 299, 2018 |
8 |
Thermal characteristics of expanded perlite/paraffin composite phase change material with enhanced thermal conductivity using carbon nanotubes Karaipekli A, Bicer A, Sari A, Tyagi VV Energy Conversion and Management, 134, 373, 2017 |
9 |
Experimental determination of temperature-dependent thermal conductivity of solid eicosane-based silver nanostructure-enhanced phase change materials for thermal energy storage Al Ghossein RM, Hossain MS, Khodadadi JM International Journal of Heat and Mass Transfer, 107, 697, 2017 |
10 |
Experimental investigation of n-eicosane based circular pin-fin heat sinks for passive cooling of electronic devices Ali HM, Arshad A International Journal of Heat and Mass Transfer, 112, 649, 2017 |